Copper Clad Laminate (CCL)
1. Description: FR4 Copper Clad Laminate combines a woven glass fabric and an epoxy resin laminate (tg approximately 130°c) that contains bromine. The product provides consistent quality and good electrical properties under dry and humid conditions, as well as high flexural, impact, and bond strength at room temperatures. This product is suitable for a variety of structural, high humidity, and electrical insulation applications, which include terminal boards, lapping carriers.
Thickness:0.6mm,0.8mm, 1.0mm, 1.2mm, 1.6mm, 2.0mm .
Thickness of copper: 18um, 35um, other thickness is according to order.
Face: 1 and 2
Size: 1020mm * 1220mm
1) The end face of foil covered board should be tidy without any delamination
and crackle .
2) Any bubble, wrinkle, pin hole, deep nick, pitting and glue spot on the copper foil covered face is not allowed. Any color changing or dirty can be easily.
removed by density 1.02g/cm3 hydrochloric acid or proper organic solution .
3) On laminated face, the defects such as bubble, impressed pitting, nick and
glue lack and outer impurity which retard its use are not allowed .